3.4-inch Round TFT-LCD Display Module (MIPI DSI Interface)

Display Panel

The module uses a 3.4-inch diagonal round TFT panel with an RGB stripe pixel arrangement and a pixel pitch of 0.0365 mm (H) × 0.1095 mm (V). The Normally Black display mode delivers a typical contrast ratio of 1200:1 and a luminance of 300 cd/m² (measured at IF = 40 mA, VF = 12.8 V, Ta = 25 °C). The NTSC color gamut reaches a typical 70%, with typical luminance uniformity of 80%, ensuring vivid and consistent colors across the circular active area.

Interface & Driver

The display is controlled by the SC7705 driver IC over a MIPI DSI interface with 4 differential data lanes (D0P/D0N–D3P/D3N) and one differential clock pair (CLKP/CLKN), supporting high-bandwidth image transmission at a typical DCLK of 48 MHz. A 30-pin FPC (0.5 mm pitch) is used, designed to mate with the OMRON XF2M-3015-1A or equivalent connector. The pinout also reserves touch interface signals (TP_INT, TP_SDA, TP_SCL, TP_RESET, TP_VCI) for optional future touch integration.

Power & Backlight

The module operates from an analog supply VCI of 2.8–3.3 V (typical 3.0 V) and a digital/logic supply IOVCC of 1.65–3.3 V (typical 1.8 V). Typical current consumption is 27 mA for VCI and 16 mA for IOVCC. The backlight consists of 8 white LEDs (4 in series × 2 in parallel) with a typical forward current of 40 mA, forward voltage of 12.0 V, and typical power consumption of 480 mW. The LED backlight has an estimated operating lifetime of 20,000 hours.

Optical Performance

All-direction viewing angle: θT/θB/θL/θR all reach 85° (CR ≥ 10). Typical response time is 30 ms (Ton + Toff). Chromaticity (CIE1931) for white is x=0.292, y=0.333; the panel supports full RGB color coordinates as specified in the optical characteristics table.

Environmental & Reliability

Operating temperature: -20 °C to +70 °C; storage temperature: -30 °C to +80 °C; humidity: 10%–90% RH. The module passes high/low temperature operation (240 h), high/low temperature storage (240 h), high-temperature high-humidity storage (60 °C, 90% RH, 240 h), thermal shock (-30 °C ↔ +70 °C, 10 cycles), and ESD testing (air discharge ±8 kV, contact discharge ±4 kV).